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1 25 a micropower voltage references isl21070 the isl21070 voltage references are analog voltage references featuring low supply voltage operation at ultra-low 25 a max operating current. additionally, the isl21070 family features guaranteed initial accuracy as low as 0.2% and 30ppm/c temperature coefficient. these references are ideal for general purpose applications for performance at lower cost. the isl21070 is provided in an industry standard 3 ld sot-23 pinout. the isl21070 offers output voltages that can be used as precision voltage sources for control loops, standby voltages for low power states for dsp, fpga, data path controllers, microcontrollers and other core voltages: 0.600v, 2.048v, and 2.5v. applications* (see page 10) ? battery management/monitoring ? low power standby voltages ? portable instrumentation ? consumer/medical electronics ? wearable electronics ? lower cost industrial and instrumentation ? power regulation circuits ? control loops and compensation networks ? led/diode supply features ? reference output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.600v, 2.048v, 2.500v ? initial accuracy: 0.600v. . . . . . . . . . . . . . . . . . . . . . . . . . 1.0% ? initial accuracy: 2.048v. . . . . . . . . . . . . . . . . . . . . . . . .0.25% ? initial accuracy: 2.5v . . . . . . . . . . . . . . . . . . . . . . . . . . . ..0.2% ? input voltage range - isl21070-06 . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7v to 5.5v - isl21070-20 . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7v to 5.5v - isl21070-25. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7v to 5.5v ? output voltage noise . . . . . . . . . . . . .30 v p-p (0.1hz to 10hz) ? supply current . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 a (max) ? tempco (0.600v only) . . . . . . . . . . . . . . . . . . . . . . . 50ppm/c ? tempco (all others) . . . . . . . . . . . . . . . . . . . . . . . . . 30ppm/c ? output current capability . . . . . . . . . . . . . . . . . . . . . . . 10ma ? operating temperature range. . . . . . . . . . . .-40c to +85c ? package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 ld sot-23 ? pb-free (rohs compliant) related literature* (see page 10) ? an1533 , ?x-ray effects on intersil fga references? ? an1 494 , ?reflow and pc board assembly effects on intersil fga references? figure 1. v out vs temperature normalized to +25c 2.4990 2.4995 2.5000 2.5005 2.5010 2.5015 2.5020 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 temperature (c) normalized to +25c v out (v) typ low high july 1, 2011 fn7599.2 caution: these devices are sensitive to electrostatic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | copyright intersil americas inc. 2010, 2011. all rights reserved intersil (and design) is a trademark owned by intersil corporation or one of its subsidiaries. all other trademarks mentioned are the property of their respective owners.
isl21070 2 fn7599.2 july 1, 2011 typical application circuit pin configuration isl21070 (3 ld sot-23) top view 0.1 f v in v out gnd isl21070 v out sense load + ? 10 f 2.7v to 5.5v 1 2 3 vout gnd v in pin descriptions pin number pin name description 1 vin input voltage connection. range: 2.7 to 5.5v 2 vout voltage reference output. 3 gnd ground connection ordering information part number (notes 1, 2, 3) part marking (note 4) v out option (v) grade temp. range (c) package tape & reel (pb-free) pkg. dwg. # isl21070dih306z-tk bdna 0.600 1.0%, 50ppm/c -40 to +85 3 ld sot-23 p3.064 ISL21070CIH320Z-TK bcha 2.048 0.25%, 30ppm/c -40 to +85 3 ld sot-23 p3.064 isl21070cih325z-tk bcja 2.5 0.2%, 30ppm/c -40 to +85 3 ld sot-23 p3.064 notes: 1. please refer to tb34 7 for details on reel specifications. 2. these intersil pb-free plastic packaged products employ special pb-free material sets, molding compounds/die attach material s, and 100% matte tin plate plus anneal (e3 termination finish, which is rohs compliant and compatible with both snpb and pb-free soldering opera tions). intersil pb-free products are msl classified at pb-free peak reflow temperatures that meet or exceed the pb-free requirements of ipc/jed ec j std-020. 3. for moisture sensitivity level (msl), please see device information page for isl2 1 0 70 . for more information on msl please see techbrief tb363 . 4. the part marking is located on the bottom of the part.
isl21070 3 fn7599.2 july 1, 2011 absolute voltage ratings thermal information max voltage v in to gnd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5v to +6.5v v out (pin) to gnd (10s) . . . . . . . . . . . . . . . . . . . . . . . . . -0.5v to v out + 1v esd ratings human body model (tested per jesd22-a114 ) . . . . . . . . . . . . . . . 6000v machine model (tested per jesd22-a115 ) . . . . . . . . . . . . . . . . . . . 500v charged device model (tested per jesd22-c101 ) . . . . . . . . . . . . . . 2kv latch up (tested per jesd-78) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100ma environmental operating conditions x-ray exposure (note 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mrem thermal resistance (typical) ja (c/w) jc (c/w) 3 ld sot-23 (notes 6, 7) . . . . . . . . . . . . . . . 275 110 continuous power dissipation (t a = +85c) . . . . . . . . . . . . . . . . . . .99mw storage temperature range. . . . . . . . . . . . . . . . . . . . . . . -65c to +150c pb-free reflow profile (note 8) . . . . . . . . . . . . . . . . . . . . . . . see link below http://www .int er sil.com/pbfree/pb-f reer ef lo w .asp recommended operating conditions temperature range (industrial) . . . . . . . . . . . . . . . . . . . . . .-40c to +85c supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7v to 5.5v caution: do not operate at or near the maximum ratings listed for extended periods of time. exposure to such conditions may adv ersely impact product reliability and result in failures not covered by warranty. notes: 5. measured with no filtering, distance of 10? from source, intensity set to 55kv and 70ma current, 30s duration. other exposur e levels should be analyzed for output voltage drift effects. see ?applications information? on page 7. 6. ja is measured with the component mounted on a high effective thermal conductivity test board in free air. see tech brief tb379 f or details. 7. for jc , the ?case temp? location is taken at the package top center. 8. post-reflow drift for the isl21070 devices will range from 100 v to 1.0mv based on experimental results with devices on fr4 double sided boards. the design engineer must take this into account when considering the reference voltage after assembly. electrical specifications (isl21070-06, v out = 0.600v) v in = 3.0v, t a = -40c to +85c, i out = 0, unless otherwise specified. boldface limits apply over the operating temperature range, -40c to +85c. symbol parameter conditions min (note 12) typ max (note 12 units v out output voltage 0.600 v v oa v out accuracy @ t a = +25c isl21070 d-grade -1.0 +1.0 % tc v out output voltage temperature coefficient (note 9) isl21070 d-grade 50 ppm/c v in input voltage range 2.7 5.5 v i in supply current 11 25 a v out / v in line regulation 2.7v < v in < 5.5v 20 250 v/v v out / i out load regulation sourcing: 0ma i out 10ma 3 100 v/ma sinking: -10ma i out 0ma 6 100 v/ma i sc short circuit current t a = +25c, v out tied to gnd 50 ma t r turn-on settling time v out = 0.1% 150 s ripple rejection f = 10khz -20 db e n output voltage noise 0.1hz f 10hz 30 v p-p v n broadband voltage noise 10hz f 10khz 10 v rms v out / t a thermal hysteresis (note 10) t a = +125c 20 ppm v out / t long term stability (note 11) t a = +25c 70 ppm electrical specifications (isl21070-20, v out = 2.048v) v in = 3.0v, t a = -40c to +85c, i out = 0, unless otherwise specified. boldface limits apply over the operating temperature range, -40c to +85c. symbol parameter conditions min (note 12) typ max (note 12 unit v out output voltage 2.048 v v oa v out accuracy @ t a = +25c isl21070 c-grade: 2.048 -0.25 +0.25 %
isl21070 4 fn7599.2 july 1, 2011 tc v out output voltage temperature coefficient (note 9) isl21070 c-grade 30 ppm/c v in input voltage range 2.7 5.5 v i in supply current 11 25 a v out / v in line regulation 2.7v < v in < 5.5v 25 250 v/v v out / i out load regulation sourcing: 0ma i out 10ma 3 100 v/ma sinking: -10ma i out 0ma 6 100 v/ma i sc short circuit current t a = +25c, v out tied to gnd 50 ma t r turn-on settling time v out = 0.1% 150 s ripple rejection f = 10khz -20 db e n output voltage noise 0.1hz f 10hz 30 v p-p v n broadband voltage noise 10hz f 10khz 10 v rms v out / t a thermal hysteresis (note 10) t a = +125c 40 ppm v out / t long term stability (note 11) t a = +25c 50 ppm electrical specifications (isl21070-20, v out = 2.048v) v in = 3.0v, t a = -40c to +85c, i out = 0, unless otherwise specified. boldface limits apply over the operating temperature range, -40c to +85c. (continued) symbol parameter conditions min (note 12) typ max (note 12 unit electrical specifications (isl21070-25, v out = 2.5v) v in = 3.0v, t a = -40c to +85c, i out = 0, unless otherwise specified. boldface limits apply over the operating temperature range, -40c to +85c. symbol parameter conditions min (note 12) typ max (note 12 unit v out output voltage 2.5 v v oa v out accuracy @ t a = +25c isl21070 c-grade -0.2 +0.2 % tc v out output voltage temperature coefficient (note 9) isl21070 c-grade 30 ppm/c v in input voltage range 2.7 5.5 v i in supply current v en = v in 11 25 a v out / v in line regulation 2.7v < v in < 5.5v 15 250 v/v v out / i out load regulation sourcing: 0ma i out 7ma 6 100 v/ma sourcing: 0ma i out 10ma (t a = +70c) 133 v/ma sinking: -10ma i out 0ma 10 100 v/ma i sc short circuit current t a = +25c, v out tied to gnd 30 ma t r turn-on settling time v out = 0.1% 150 s ripple rejection f = 10khz -20 db e n output voltage noise 0.1hz f 10hz 30 v p-p v n broadband voltage noise 10hz f 10khz 10 v rms v out / t a thermal hysteresis (note 10) t a = +125c 20 ppm v out / t long term stability (note 11) t a = +25c 50 ppm notes: 9. over the specified temperature range. temperature coefficient is measured by the box method whereby the change in v out is divided by the temperature range; in this case, -40c to +85c = +125c. 10. thermal hysteresis is the change of v out measured @ t a = +25c after temperature cycling over a specified range, t a . v out is read initially at t a = +25c for the device under test. the device is temperature cycled and a second v out measurement is taken at +25c. the difference between the initial v out reading and the second v out reading is then expressed in ppm. for t a = +125c, the device under test is cycled from +25c to +85c to -40c to +25c. 11. long term drift is logarithmic in nature and diminishes over time. drift after the first 1000 hours will be approximately 1 0ppm/ 1khr s 12. compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.
isl21070 5 fn7599.2 july 1, 2011 typical performance characteristics curves v out = 2.5v, v in = 3v, i out = 0ma, t a = +25c unless otherwise specified. figure 2. i in vs v in , 3 units figure 3. i in vs v in over-temperature figure 4. line regulation, 3 units figure 5. line regulation over-temperature figure 6. v out vs temperature normalized to +25c figure 7. line transient response, with 1nf capacitive load 0 2 4 6 8 10 12 14 16 18 20 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 v in (v) i in ( a) typ low high 8 9 10 11 12 13 14 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 v in (v) i in ( a) +25c -40c -85c 2.49990 2.49995 2.50000 2.50005 2.50010 2.50015 2.50020 2.50025 2.50030 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 v out (v) normalized to 2.5v at v in = 3.0v typ low high v in (v) -150 -100 -50 0 50 100 150 200 normalized to v in = 3.0v v out ( v) 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 v in (v) +25c -40c -85c 2.4990 2.4995 2.5000 2.5005 2.5010 2.5015 2.5020 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 temperature (c) normalized to +25c v out (v) typ low high -25 -20 -15 -10 -5 0 5 10 15 20 25 0 50 100 150 200 250 300 350 400 450 500 time ( s) v out (mv) v in = -0.3v v in = +0.3v
isl21070 6 fn7599.2 july 1, 2011 figure 8. line transient response, with no capacitive load figure 9. load regulation over-temperature figure 10. load transient response figure 11. load transient response figure 12. dropout figure 13. turn-on time typical performance characteristics curves v out = 2.5v, v in = 3v, i out = 0ma, t a = +25c unless otherwise specified. (continued) -25 -20 -15 -10 -5 0 5 10 15 20 25 0 50 100 150 200 250 300 350 400 450 500 time ( s) v out (mv) v in = -0.3v v in = +0.3v -100 -80 -60 -40 -20 0 20 40 60 80 100 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 10 load (ma) sinking sourcing 123456789 v out ( v) +25c -40c -85c -500 -400 -300 -200 -100 0 100 200 300 400 500 0 20 40 60 80 100 120 140 160 180 200 time ( s) v out (mv) i load = -10ma i load = +10ma -200 -160 -120 -80 -40 0 40 80 120 160 200 0 20 40 60 80 100 120 140 160 180 200 time ( s) v out (mv) i load = -50ma i load = +50ma 2.490 2.492 2.494 2.496 2.498 2.500 2.502 2.504 2.506 2.508 2.510 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 v in (v) v out (v) no load 10ma load 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 50 100 150 200 250 300 time ( s) v out (v) typ low high vdd
isl21070 7 fn7599.2 july 1, 2011 applications information fga technology the isl21070 series of voltage references use the floating gate technology to create references with very low drift and supply current. essentially, the charge stored on a floating gate cell is set precisely in manufacturing. the reference voltage output itself is a buffered version of the floating gate voltage. the resulting reference device has excellent characteristics which are unique in the industry: very low temperature drift, high initial accuracy, and almost zero supply current. also, the reference voltage itself is not limited by voltage bandgaps or zener settings, so a wide range of reference voltages can be programmed (standard voltage settings are provided, but customer-specific voltages are available). the process used for these reference devices is a floating gate cmos process, and the amplifier circuitry uses cmos transistors for amplifier and output transistor circuitry. while providing excellent accuracy, there are limitations in output noise level and load regulation due to the mos device characteristics. these limitations are addressed with circuit techniques discussed in other sections. handling and board mounting fga references provide excellent initial accuracy and low temperature drift at the expense of very little power drain. there are some precautions to take to insure this accuracy is not compromised. excessive heat during solder reflow can cause excessive initial accuracy drift, so the recommended +260c max temperature profile should not be exceeded. expect up to 1mv drift from the solder reflow process. fga references are susceptible to excessive x-radiation like that used in pc board manufacturing. initial accuracy can change 10mv or more under extreme radiation. if an assembled board needs to be x-rayed, care should be taken to shield the fga reference device. figure 14. z out vs f vs c l figure 15. psrr vs frequency figure 16. v out noise, 0.1hz to 10hz typical performance characteristics curves v out = 2.5v, v in = 3v, i out = 0ma, t a = +25c unless otherwise specified. (continued) 0 20 40 60 80 100 120 1 10 100 1k 10k 100k 1m frequency (hz) z out ( ) 1nf load 10nf load 100nf load no load -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 1 10 100 1k 10k 100k 1m 10m frequency (hz) psrr (db) no load 100nf load 1nf load 10nf load 1s/div 5 v/div
isl21070 8 fn7599.2 july 1, 2011 board mounting considerations for applications requiring the highest accuracy, board mounting location should be reviewed. placing the device in areas subject to slight twisting can cause degradation of the accuracy of the reference voltage due to die stresses. it is normally best to place the device near the edge of a board, or the shortest side, as the axis of bending is most limited at that location. obviously, mounting the device on flexprint or extremely thin pc material will likewise cause loss of reference accuracy. board assembly considerations fga references provide high accuracy and low temperature drift but some pc board assembly precautions are necessary. normal output voltage shifts of 100 v to 1mv can be expected with pb- free reflow profiles or wave solder on multi-layer fr4 pc boards. precautions should be taken to avoid excessive heat or extended exposure to high reflow or wave solder temperatures, this may reduce device initial accuracy. post-assembly x-ray inspection may also lead to permanent changes in device output voltage and should be minimized or avoided. if x-ray inspection is required, it is advisable to monitor the reference output voltage to verify excessive shift has not occurred. if large amounts of shift are observed, it is best to add an x-ray shield consisting of thin zinc (300 m) sheeting to allow clear imaging, yet block x-ray energy that affects the fga reference. special applications considerations in addition to post-assembly examination, there are also other x- ray sources that may affect the fga reference long term accuracy. airport screening machines contain x-rays and will have a cumulative effect on the voltage reference output accuracy. carry-on luggage screening uses low level x-rays and is not a major source of output voltage shift, however, if a product is expected to pass through that type of screening over 100 times, it may need to consider shielding with copper or aluminum. checked luggage x-rays are higher intensity and can cause output voltage shift in much fewer passes, thus devices expected to go through those machines should definitely consider shielding. note that just two layers of 1/2 ounce copper planes will reduce the received dose by over 90%. the leadframe for the device which is on the bottom also provides similar shielding. if a device is expected to pass through luggage x-ray machines numerous times, it is advised to mount a 2-layer (minimum) pc board on the top, and along with a ground plane underneath will effectively shield it from 50 to 100 passes through the machine. since these machines vary in x-ray dose delivered, it is difficult to produce an accurate maximum pass recommendation. noise performance and reduction the output noise voltage in a 0.1hz to 10hz bandwidth is typically 30 v p-p . the noise measurement is made with a bandpass filter made of a 1 pole high-pass filter with a corner frequency at 0.1hz and a 2-pole low-pass filter with a corner frequency at 12.6hz to create a filter with a 9.9hz bandwidth. wideband noise is reduced by adding capacitor to the output, but the value should be limited to 1nf or less to insure stability. temperature drift the limits stated for output accuracy over-temperature are governed by the method of measurement. for the -40c to 85c temperature range, measurements are made at +25c and the two extremes. this measurement method combined with the fact that fga references have a fairly linear temperature drift characteristic insures that the limits stated will not be exceeded over the temperature range. isl21070 used as a low cost precision current source using an n-jet and the isl21070, a precision, low cost, high impedance current source can be created. the precision of the current source is largely dependent on the tempco and accuracy of the reference. the current setting resistor contributes less than 20% of the error. figure 17. isl21070 used as a low cost precision current source +8v to 28v 0.01 f v in v out 1k r set 0.1% 10ppm/c i sy ~ 11 a il at 0.1% accuracy ~2.5011ma isl21070-2.5 z out > 100m i set v out i set = r set i l = i set + ir set v out = 2.5v gnd
isl21070 9 fn7599.2 july 1, 2011 typical application circuits figure 18. precision 2.5v 50ma reference figure 19. 2.5v full scale low-drift 10-bit adjustable voltage source figure 20. kelvin sensed load v in = 3.0v 2n2905 2.5v/50ma 0.001 f v in v out gnd isl21070 r = 200 v in v out gnd 2.7v to 5.5v 0.1 f 0.001 f v out + ? v cc r h r l x9119 v ss sda scl 2-wire bus v out (buffered) 10 f isl21070 0.1 f v in v out gnd isl21070 v out sense load + ? 10 f 2.7v to 5.5v
isl21070 10 intersil products are manufactured, assembled and tested utilizing iso9000 quality systems as noted in the quality certifications found at www .int er sil.com/design/q uality intersil products are sold by description only. intersil corporation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnished by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringem ents of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of i ntersil or its subsidiaries. for information regarding intersil corporation and its products, see www .int er sil.com fn7599.2 july 1, 2011 for additional products, see www .int er sil.com/pr oduct_tree products intersil corporation is a leader in the design and manufacture of high-performance analog semiconductors. the company's product s address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and noteb ooks. intersil's product families address power management and analog signal processing functions. go to www .int er sil.com/pr oducts for a complete list of intersil product families. *for a complete listing of applications, related documentation and related parts, please see the respective device information page on intersil.com: isl2 1 0 70 to report errors or suggestions for this datasheet, please go to www .int er sil.com/ask our staf f fits are available from our website at http://rel.int er sil.com/repor ts/sear c h.php revision history the revision history provided is for informational purposes only and is believed to be accurate, but not warranted. please go t o web to make sure you have the latest rev. date revision change 4/4/11 fn7599.2 converted to new intersil template updated page 1 description (removed 3.3v from last paragraph) updated ?features? on page 1 as follows: -removed 3.3v from reference output voltage bullet. -removed "initial accuracy: 3.3v from 2.5v...0.2% option" -removed ?isl21070-33 (coming soon)? under input voltage range bullet updated ?ordering information? on page 2 as follows: -removed isl21070cih333z-tk 3.3v option updated ?electrical specification? as follows: -removed 3.3v option electrical specification header and table updated parameters note in electrical spec from ?parameters...? to ?compliance...? 8/19/10 fn7599.1 added product variation for 0.6v and 2.048v. removed 1.024v coming soon part. updated throughout accordingly as follows: updated page 1 description (removed 1.024v from last paragraph and added 0.6v) updated ?features? on page 1 as follows: -removed 1.024v from reference output voltage bullet. added 0.600v. -removed "initial accuracy: 1.024v . . .0.5%" and added "initial accuracy: 0.600v . . 1.0%" -removed "coming soon" from isl21070-20 under input voltage range bullet. also, removed isl21070-10 (coming soon) part and added isl21070-06 part. -added "tempco (0.600v only). . . . . 50ppm/c" -added "all others" to "tempco (all others) . . . 30ppm/c" updated ?ordering information? on page 2 to add isl21070dih306z-tk 0.6v option. removed 1.024v option isl21070cih310z-tk added note 4 to part marking column of ?ordering information? on page 2. -added "electrical specifications (isl21070-06, vout = 0.600v)" table to page 3 and "electrical specifications (isl21070-20, vout = 2.048v)" table to page 3 -removed "electrical specifications (isl21070-xx, vout = 1.024v to 2.048v)" table added theta jc of 110 to ?thermal information? on page 3. added applicable theta jc note 7 (?for jc , the ?case temp? location is taken at the package top center.?) revised theta ja in ?thermal information? on page 3 from 371 to 275 added figure 16. ?vout noise, 0.1hz to 10hz? to page 7. 3/19/10 fn7599.0 initial release.
isl21070 11 fn7599.2 july 1, 2011 package outline drawing p3.064 3 lead small outline transistor plastic package (sot23-3) rev 2, 9/09 reference jedec to-236. footlength is measured at reference to gauge plane. dimension does not include interlead flash or protrusions. dimensioning and tolerancing conform to amsey14.5m-1994. 3. 5. 4. 2. dimensions are in millimeters. 1. notes: detail "a" side view typical recommended land pattern top view c 0.10 c 0.20 m c l c 1.300.10 c l 0.950 2.370.27 2.920.12 4 4 10 typ (2 plcs) 0.013(min) 0.100(max) seating plane 1.000.12 0.910.03 seating plane gauge plane 0.25 0.310.10 detail "a" 0.4350.065 0 - 8 deg. (2.15) (1.25) (0.60) (0.95 typ.) 5 0.130.05 dimensions in ( ) for reference only. interlead flash or protrusions shall not exceed 0.25mm per side.

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